Monday, Jun 18, 2018
TECNISCO,LTD.


Vision/Mission

“Contribute to human happiness by achieving what may seem impossible, utilizing ingenious micro processing technology.”

 

Behavior Identity

“Venture by thinking, realize by trying”

 

Business Description

Precision products provider for optoelectronics, electronics and life science industries

 

Competitive Advantages

"Cross-edge" microprocessing

"Cross-edge" microprocessing technology means combined technologies crossing more than two different leading-edge processing technologies to make a product. The technology is based on the following five processing technologies: Cutting, Grinding, Polishing, Metalizing, and Bonding. Through the "Cross-edge" microprocessing technology, we can provide the four advantages below by undertaking several processes as a one-stop solution partner.

① Maintaining the stability of product quality

② Shortening the lead time

③ Providing better cost-performance products and services

④ Solving customers’  problems by crossing our technologies and developing an original products 

 

Products/Services

・Heatsinks for optical communication, industrial laser, power semiconductor devices, MPU, etc

・Glass products for display devices for sensors, mobile devices, semiconductors, life science equipment, etc

 

Markets

・Optical communication

・Industrial laser

・AV/mobile

・Automotive

・Life science

・Semiconductors, etc.

 

Industry

Top share in the industry of heatsinks for industrial laser

Top 5 share in the industry of heatsinks for optical communination

Top 3 share in the industry of structured glass wafers

 

Background

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" micro processing technology, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, automotive, life science devices, etc.

 

Location

・Head Office:2-2-15, Minami-Shinagawa, Shinagawa-ku, Tokyo, 140-0004, Japan

・Hiroshima Factory : 2-8-13, Hirotagaya, Kure-shi, Hiroshima, 737-0134, Japan

・SuZhou Factory(TECNISCO (SuZhou) CO.,LTD.): No.4 Japanese Industrial Village,No.300, QingChengShan Road, New District, SuZhou, JiangSu, P.R.China 215153

・Singapore Factory(TECNISCO Advanced Materials Pte Ltd) :No.70 Tuas South Street5 Singapore 637806

 

Management

Chairman of the Board

CEO:                                                            

Keizo Sekiya

COO:                                                            

Hokichi Yoshioka

CFO, Vice President

Corporate Management Support Division:   

Masayuki Aihara

General Manager, Hiroshima Factory

Quality Management Representative:

Makoto Hirao

Chief Business Development Officer:         

Tomotaka Murakami

External Director:

Takuma Saito

Corporate Auditor:                           

Takashi Hirai

Kenichi Sekiya

Koji Hirayama

 

Employees

342 (as of the end of March, 2018)

 

 


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