Vision/Mission
“Contribute to human happiness by achieving what may seem impossible, utilizing ingenious micro processing technology.”
Behavior Identity
“Venture by thinking, realize by trying”
Business Description
Precision products provider for optoelectronics, electronics and life science industries
Competitive Advantages
"Cross-edge" microprocessing
"Cross-edge" microprocessing technology means combined technologies crossing more than two different leading-edge processing technologies to make a product. The technology is based on the following five processing technologies: Cutting, Grinding, Polishing, Metalizing, and Bonding. Through the "Cross-edge" microprocessing technology, we can provide the four advantages below by undertaking several processes as a one-stop solution partner.
① Maintaining the stability of product quality
② Shortening the lead time
③ Providing better cost-performance products and services
④ Solving customers’ problems by crossing our technologies and developing an original products
Products/Services
・Heatsinks for optical communication, industrial laser, power semiconductor devices, MPU, etc
・Glass products for display devices for sensors, mobile devices, semiconductors, life science equipment, etc
Markets
・Optical communication
・Industrial laser
・AV/mobile
・Automotive
・Life science
・Semiconductors, etc.
Industry
Top share in the industry of heatsinks for industrial laser
Top 5 share in the industry of heatsinks for optical communination
Top 3 share in the industry of structured glass wafers
Background
TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" micro processing technology, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, automotive, life science devices, etc.
Location
・Head Office：2-2-15, Minami-Shinagawa, Shinagawa-ku, Tokyo, 140-0004, Japan
・Hiroshima Factory ： 2-8-13, Hirotagaya, Kure-shi, Hiroshima, 737-0134, Japan
・SuZhou Factory(TECNISCO (SuZhou) CO.,LTD.)： No.4 Japanese Industrial Village，No.300, QingChengShan Road, New District, SuZhou, JiangSu, P.R.China 215153
・Singapore Factory(TECNISCO Advanced Materials Pte Ltd) ：No.70 Tuas South Street5 Singapore 637806
Management
Chairman of the Board
CEO:
Keizo Sekiya
COO:
Hokichi Yoshioka
CFO, Vice President
Corporate Management Support Division:
Masayuki Aihara
General Manager, Hiroshima Factory
Quality Management Representative:
Makoto Hirao
Chief Business Development Officer:
Tomotaka Murakami
External Director:
Takuma Saito
Corporate Auditor:
Takashi Hirai
Kenichi Sekiya
Koji Hirayama
Employees
342 (as of the end of March, 2018)
